Are you part of an Ohio technology company?
Get R&D started at Nanotech West!
The Ohio State University and Nanotech West Lab are happy to announce new staff devoted to assisting in research and development geared toward creating new products for qualifying Ohio companies.
The experienced scientists and engineers of the Ohio Sensor and Semiconductor Innovation Platform (OSSIP) will work closely with you to solve problems, refine your process and bring new technology to market.
OSSIP has helped over 5 Ohio companies create new product lines.
The companies range from single-employee startups to well-established companies of a few hundred employees.
Participation does not require disclosure of any confidential information.
Many companies who do wish to share proprietary information opt for a Confidential Disclosure Agreement, provided by the University Technology Control Office free of charge.
Contact OSSIP
To get started, contact Jay DeLombard at:
(614) 292-0774
delombard.1@osu.edu.
Capabilities Include:
Metalorganic Chemical Vapor Deposition Epitaxial Growth
Aixtron metalorganic chemical vapor deposition (MOCVD) of III-V materials capable of growing (In, Al, Ga) (As, P, Sb) compound semiconductors
Scanning Electron Microscopy
imaging, composition and spectroscopy for failure mode investigation and structure analysis
Lapping and Chemical-Mechanical Polishing
Logitech PM4 lapping using alumina, norbide, diamond; Logitech PM5 polishing using Nalco CMP suspensions
Picosun SUNALE Atomic Layer Deposition
lower temperature oxides and nitrides of zinc, aluminum, hafnium, titanium, tantalum
Electron Beam Lithography
lithography down to sub-20nm or better, photomask layout and fabrication
E-Beam Evaporation Coating
electron-beam evaporation of Ag, Al, Au, Cr, Ge, Ni, Pd, Pt, Ti, Mo, and more
Sputter Deposition
metallic and reactive sputtering of Ag, Al, Al2O3 , Co, Cr, Cu, Fe, ITO, Mo, Nb, Nb2O5, Ni, NiCr (80/20%), NiFe, SiO2, Ti, V, W, W/Ti (10/90%)
Photolithography
spin coating of photoresists; contact and step-and-repeat exposure systems; Heidelberg µPG 501 maskless direct-write lithography tool; two standard spin-on glass processes
K&S 7100 Precision Dicing Saw
dicing of all different substrate materials, including silicon, sapphire, glass quartz, fused silica, SiC, GaN, InP, LiNbO3, LiTaO3
Reactive Ion Etching
high precision inductively-coupled plasma reactive ion etching of most materials using BCl3, CF4, O2, CHF3, Cl2, Ar
Chemical Processing
four cleanroom wet benches available for cleaning and etching processes
Chemical Vapor Deposition Of Silicon Oxides And Nitrides
PECVD of silicon oxide and silicon nitride using simple preprogrammed routines in the Plasmatherm 790; LPCVD stoichiometric or low-stress silicon nitride processes
Microscopy and Measurement
high precision microscopy and photography of samples, as well as atomic force microscopy with biological imaging capability, ellipsometry and nanometrics thin-film measurement systems
Thermal Processing
rapid thermal annealers, tube furnaces, and ovens are all available for any custom processing required, carbon nanotube deposition